Spectra7 to Participate in the Keybanc Capital Markets 18th Annual Emerging Technology Summit Conference
February 27, 2023 SAN JOSE, CA - (PR NewsWire) – (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for data centers, 5G infrastructure, virtual and augmented reality, and other connectivity markets, today announced that management will be participating in the KeyBanc Capital Markets 18th Annual Emerging Technology Summit on March 7, 2023 in the Semiconductor Infrastructure Enablers track.
The in-person conference will be held at the Hyatt Regency Downtown SOMA in San Francisco, Calif.
To arrange a meeting with Spectra7, please contact your KeyBanc representative. Investors may also contact Spectra7 investor relations at ir@spectra7.com ir@spectra7.com to arrange a meeting.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed, and resolution to enable disruptive industrial design for leading electronics manufacturers in data centers, 5G infrastructure, virtual and augmented reality, and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and technical support location in Dongguan, China.
Neither the TSX Venture Exchange nor its regulation services provided (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.
For more information, please contact:
Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com
Spectra7 Microsystems Inc.
Bonnie Tomei
Chief Financial Officer
669-212-1089
ir@spectra7.com
Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com